Ibyiza bya Diamond Wire Cutting Fluid

Byoherejwe 2018-07-11Diamond wire gukata amazi ni ubwoko bushya bwibicuruzwa.Ikoreshwa cyane cyane mugukata insinga ya corundum yibikoresho bidafite ibyuma byoroshye nka silikoni ya monocrystalline na silicon polycrystalline.Ifite amavuta meza, gukonjesha, kurwanya ruswa, kurwanya ingese na hydrogène yo guhagarika.Ubuso bwa wafer ya silicon ifite TTV ntoya, ibimenyetso bidafite umugozi, kandi birashobora kongera ubuzima bwinsinga ya diyama.

Ibyiza:

1．Ikoranabuhanga ryihariye ryemewe rihagarika kandi rikuraho ifu ya chip silicon mugihe cyo gukata, wirinda ingaruka z'umutekano ziterwa no kwegeranya igihe kirekire.

2．Ingaruka nziza yo gusiga irashobora gukumira neza gucikamo ibice cyangwa gutobora wafer ya silicon mugihe cyo gutema, kugabanya ubukana bwubuso hamwe nubuso bwubuso bwa wafer wa silicon, kandi bikagabanya gutandukana kwubunini bwuzuye bwa silikoni yatunganijwe;

3．Ibintu byiza birwanya ruswa kandi birwanya ingese, birinda ibikoresho kwangirika mu bidukikije;

4．Icyongeweho cyiza kugirango urambe insinga ya diyama;

5．Kugira ngo ukire neza, ifu ya chip silicon hamwe namazi yo gukata birashobora kuvurwa gusa no gukoreshwa na centrifugation hamwe nubutaka, bityo bikagabanya neza igiciro cyumusaruro.

6．Byoroshye koza nyuma yo gukata